Thermomechanical Impact of Polyurethane Potting on Gun Launched Electronics

Table 4

Material assumptions.

Part	Material	Young's modulus	Poisson's ratio	Mass density	Ref. temperature	Material model
		MPa		Kg/m^3	°C
Solder	Solder-sn60-pb40	3𝐸 + 05	0.4	8598	All	Linear elastic plastic
Chips	Ceramic_X7R	1.05𝐸 + 05	0.3	5624	All	Linear elastic plastic
Can	Aluminum	7𝐸 + −4	0.3	2716	All	Linear elastic plastic
Potting	Alchemix	6131	0.49	1604	−51	Linear elastic/viscoelastic
Potting	Alchemix	120	0.49	1604	23	Linear elastic/viscoelastic
Potting	Alchemix	7.2	0.49	1604	71	Linear elastic/viscoelastic
Connectors	Plastic	3.6𝐸 + 04	0.23	4235	All	Linear elastic plastic
Board	FR4	2.5𝐸+ 04	0.15	1925	All	Orthotropic elasticity