Electrochemical Fabrication of Shape-Controlled Copper Hierarchical Structures Assisted by Surfactants
Figure 3
SEM images of the products by adding CTAB in the electrolyte at the different deposition times of 10 min (a), 20 min (b), 30 min (c), and 1 h (d). The insets in Figures 3(a)–3(d) show the magnification SEM images of the corresponding photos.
