Journals
Publish with us
Publishing partnerships
About us
Blog
Journal of Nanomaterials
Journal overview
For authors
For reviewers
For editors
Table of Contents
Special Issues
Journal of Nanomaterials
/
2013
/
Article
/
Fig 8
/
Research Article
Wearout Reliability and Intermetallic Compound Diffusion Kinetics of Au and PdCu Wires Used in Nanoscale Device Packaging
Figure 8
Typical CuAl IMC microcracks post extended UHAST stress (1000 hr).
(a)
(b)