Wearout Reliability and Intermetallic Compound Diffusion Kinetics of Au and PdCu Wires Used in Nanoscale Device Packaging

Table 2

Summary of IMC diffusion kinetics and activation energies comparing Au and PdCu ball bonds used in 110 nm device packaging.

IMC Type	HTSL test conditions	𝐸aa (eV)	𝐷𝑜 (m^2s^−1)	Reference
CuAl	175, 200, 250	0.63 to 0.78	1.21 × 10^−7	[13, 14]
CuAl	200, 250, 300	1.01	1.21 × 10^−7	[15]
CuAl	150, 200	1.34	1.63 × 10^−4	[16]
CuAl	Unknown	2.04	2.00 × 10^−5	[17]
CuAl	175, 200, 225, 250	1.26	3.70 × 10^−5	[18]
CuAl	150, 250, 300	1.14	N/A	[19, 20]
CuAl	150, 175, 200	1.18	1.43 × 𝟏𝟎^−𝟖	This work
AuAl	Unknown	1.80	9.10 × 10^−6	[17]
AuAl	Unknown	1.00	2.62 × 10^−7	[21]
AuAl	150, 175, 200	1.04	1.97 × 𝟏𝟎^−𝟗	This work