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Journal of Nanomaterials
Volume 2013, Article ID 534709, 10 pages
http://dx.doi.org/10.1155/2013/534709
Research Article

Low Temperature Flex-on-Flex Assembly Using Polyvinylidene Fluoride Nanofiber Incorporated Sn58Bi Solder Anisotropic Conductive Films and Vertical Ultrasonic Bonding

Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon 305-701, Republic of Korea

Received 9 August 2013; Accepted 15 November 2013

Academic Editor: Gajanan S. Bhat

Copyright © 2013 Tae-Wan Kim et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Citations to this Article [11 citations]

The following is the list of published articles that have cited the current article.

  • Sang Hoon Lee, Tae Wan Kim, and Kyung-Wook Paik, “Plasma-etched nanofiber anisotropic conductive films (ACFs) for ultra fine pitch interconnection,” 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), pp. 142–145, . View at Publisher · View at Google Scholar
  • Ji-Soo Lee, Ji-Hye Kim, and Kyung-Wook Paik, “A Study on the Fine Pitch Flex-on-Flex (FOF) Assembly Using Flux Added Nanofiber Solder Anisotropic Conductive Films (ACFs) and Thermo-Compression Bonding Method,” 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), pp. 2168–2174, . View at Publisher · View at Google Scholar
  • Dal-Jin Yoon, Sanh Hoon Lee, and Kyung-Wook Paik, “A Study on the Novel Nylon Anchoring Polymer Layer(APL) Anisotropic Conductive Films(ACFs) for Ultra Fine Pitch Chip-on-Glass(COG) Applications,” 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), pp. 1113–1118, . View at Publisher · View at Google Scholar
  • Dal-Jin Yoon, Sang Hoon Lee, and Kyung-Wook Paik, “A Study on the Anchoring Polymer Layer(APL) Solder Anisotropic Conductive Films (ACFs) for Ultra Fine Pitch Flex-on-Flex (FOF) Assembly Using an Ultrasonic Bonding Method,” 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), pp. 15–20, . View at Publisher · View at Google Scholar
  • Kyung-Wook Paik, Sang-Hoon Lee, and Tae-Wan Kim, “Nanofiber ACFs (anisotropic conductive films) for ultra-fine pitch interconnection,” 2015 IEEE 15th International Conference on Nanotechnology (IEEE-NANO), pp. 581–587, . View at Publisher · View at Google Scholar
  • Tae-Wan Kim, Sang-Hoon Lee, and Kyung-Wook Paik, “Effect of aligned nanofiber in nanofiber solder anisotropic conductive films (ACFs) on the solder ball movement for flex-on-flex (FOF) assembly,” 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), pp. 271–278, . View at Publisher · View at Google Scholar
  • Tae Wan Kim, Kyung-Wook Paik, and Sang Hoon Lee, “A study on nanofiber anisotropic conductive films (ACFs) for fine pitch chip-on-glass (COG) interconnections,” Proceedings - Electronic Components and Technology Conference, pp. 1060–1063, 2014. View at Publisher · View at Google Scholar
  • Hsien-Chie Cheng, Ching-Feng Yu, and Wen-Hwa Chen, “ Size, Temperature, and Strain-Rate Dependence on Tensile Mechanical Behaviors of Ni 3 Sn 4 Intermetallic Compound Using Molecular Dynamics Simulation ,” Journal of Nanomaterials, vol. 2014, pp. 1–17, 2014. View at Publisher · View at Google Scholar
  • Tae-Wan Kim, Tae-Ik Lee, Yan Pan, Wansun Kim, Shuye Zhang, Taek-Soo Kim, and Kyung-Wook Paik, “Effect of Nanofiber Orientation on Nanofiber Solder Anisotropic Conductive Films Joint Properties and Bending Reliability of Flex-on-Flex Assembly,” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 6, no. 9, pp. 1317–1329, 2016. View at Publisher · View at Google Scholar
  • Daniel Lu, and C. P. Wong, “Electrically Conductive Adhesives (ECAs),” Materials for Advanced Packaging, pp. 421–468, 2016. View at Publisher · View at Google Scholar
  • Yan Pan, Lu Song, Shuye Zhang, Xionghui Cai, and Kyung-Wook Paik, “Effects of Polymer Conductive Particle Contents on the Electrical Performance and Reliability of 50- $\mu \text{m}$ Pitch Flex-on-Flex Assemblies Using Anisotropic Conductive Films,” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 7, no. 11, pp. 1759–1764, 2017. View at Publisher · View at Google Scholar