Journal of Nanomaterials
Volume 2014, Article ID 214510, 17 pages
http://dx.doi.org/10.1155/2014/214510
Size, Temperature, and Strain-Rate Dependence on Tensile Mechanical Behaviors of Ni3Sn4 Intermetallic Compound Using Molecular Dynamics Simulation
1Department of Aerospace and Systems Engineering, Feng Chia University, Taichung 40724, Taiwan
2Department of Power Mechanical Engineering, National Tsing Hua University, Hsinchu 30013, Taiwan
Received 17 March 2014; Accepted 7 June 2014; Published 27 August 2014
Academic Editor: Fathallah Karimzadeh
Copyright © 2014 Hsien-Chie Cheng et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
How to Cite this Article
Hsien-Chie Cheng, Ching-Feng Yu, and Wen-Hwa Chen, “Size, Temperature, and Strain-Rate Dependence on Tensile Mechanical Behaviors of Ni3Sn4 Intermetallic Compound Using Molecular Dynamics Simulation,” Journal of Nanomaterials, vol. 2014, Article ID 214510, 17 pages, 2014. https://doi.org/10.1155/2014/214510.