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Journal of Nanomaterials
Volume 2014, Article ID 518520, 8 pages
Research Article

Agglomeration and Dendritic Growth of Cu/Ti/Si Thin Film

1State Key Laboratory of Mechanical Manufacturing Systems Engineering, Xi’an Jiaotong University, Xi’an 710049, China
2State Key Laboratory of Digital Manufacturing Equipment & Technology, Huazhong University of Science and Technology, Wuhan 430074, China

Received 12 September 2013; Accepted 20 December 2013; Published 30 January 2014

Academic Editor: Sherine Obare

Copyright © 2014 Qi-jing Lin et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


Agglomeration and the transformation from random fractal to dendritic growth have been observed during Cu/Ti/Si thin film annealing. The experimental results show that the annealing temperature, film thickness, and substrate thickness influenced the agglomeration and dendritic growth. Multifractal spectrum is used to characterize the surface morphology quantificationally. The shapes of the multifractal spectra are hook-like to the left. Value of increases with the annealing temperature rising, and increases from 500°C to 700°C but reduces from 700°C to 800°C. The dendritic patterns with symmetrical branches are generated in the surfaces when the thin films were annealed at 800°C.