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Journal of Nanomaterials
Volume 2015, Article ID 820893, 5 pages
http://dx.doi.org/10.1155/2015/820893
Research Article

Thermoelectric Transport Properties of Cu Nanoprecipitates Embedded

1Korea Institute of Ceramic Engineering and Technology, Icheon Branch, Icheon 467-843, Republic of Korea
2School of Energy, Materials and Chemical Engineering, Korea University of Technology and Education, Cheonan 330-708, Republic of Korea
3Energy and Environmental Division, Korea Institute of Ceramic Engineering and Technology, Seoul 153-801, Republic of Korea
4Department of Nano Applied Engineering, Kangwon National University, Chuncheon 200-701, Republic of Korea

Received 20 October 2014; Revised 14 February 2015; Accepted 7 March 2015

Academic Editor: Doron Yadlovker

Copyright © 2015 Eunsil Lee et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

How to Cite this Article

Eunsil Lee, Jin Il Kim, Soon-Mok Choi, et al., “Thermoelectric Transport Properties of Cu Nanoprecipitates Embedded ,” Journal of Nanomaterials, vol. 2015, Article ID 820893, 5 pages, 2015. https://doi.org/10.1155/2015/820893.