Effect of Micro- to Nanosize Inclusions upon the Thermal Conductivity of Powdered Composites with High and Low Interface Resistance

<div>Cu/diamond composite system: <svg height="18.0794pt" id="M91" style="vertical-align:-5.528899pt" version="1.1" viewbox="-0.0498162 -12.5505 24.918 18.0794" width="24.918pt" xmlns="http://www.w3.org/2000/svg" xmlns:xlink="http://www.w3.org/1999/xlink"><rect height="0.65243" width="6.56351" x="0" y="-11.8482"></rect><g transform="matrix(.013,0,0,-0.013,0,0)"><path d="M480 416C480 431 465 448 438 448C388 448 312 383 252 330C217 299 188 273 155 237H153L257 680C262 700 263 712 253 712C240 712 183 684 97 674L92 648L126 647C166 646 172 645 163 606L23 -6L29 -12C51 -5 77 2 107 8C115 62 130 128 142 180C153 193 179 220 204 241C231 170 259 106 288 54C317 0 336 -12 358 -12C381 -12 423 2 477 80L460 100C434 74 408 54 398 54C385 54 374 65 351 107C326 154 282 241 263 299C296 332 351 377 403 377C424 377 436 372 445 368C449 366 456 368 462 375C472 386 480 402 480 416Z" id="g113-108"></path><glyph.data ascent="3473" descent="-2876" horiz-adv-x="503" vert-adv-y="503"></glyph.data></g><g transform="matrix(.013,0,0,-0.013,6.564,0)"><path d="M368 703H309L44 -163H104L368 703Z" id="g113-48"></path><glyph.data ascent="3473" descent="-2876" horiz-adv-x="412" vert-adv-y="412"></glyph.data></g><g transform="matrix(.013,0,0,-0.013,11.925,0)"><path d="M480 416C480 431 465 448 438 448C388 448 312 383 252 330C217 299 188 273 155 237H153L257 680C262 700 263 712 253 712C240 712 183 684 97 674L92 648L126 647C166 646 172 645 163 606L23 -6L29 -12C51 -5 77 2 107 8C115 62 130 128 142 180C153 193 179 220 204 241C231 170 259 106 288 54C317 0 336 -12 358 -12C381 -12 423 2 477 80L460 100C434 74 408 54 398 54C385 54 374 65 351 107C326 154 282 241 263 299C296 332 351 377 403 377C424 377 436 372 445 368C449 366 456 368 462 375C472 386 480 402 480 416Z" id="g113-108"></path><glyph.data ascent="3473" descent="-2876" horiz-adv-x="503" vert-adv-y="503"></glyph.data></g><g transform="matrix(.0091,0,0,-0.0091,18.399,3.132)"><path d="M620 667C620 684 593 710 552 710C515 710 459 687 409 634C360 582 334 506 320 433H247L215 400L220 388H310L259 80C224 -129 199 -161 185 -174C175 -183 160 -192 141 -192C123 -192 90 -181 75 -165C69 -158 64 -156 54 -164C39 -178 24 -195 24 -208C24 -231 61 -257 94 -257C124 -257 162 -243 209 -194C267 -134 303 -66 343 107C369 220 378 279 393 385L503 397L523 433H404C432 619 464 660 500 660C522 660 542 646 566 621C573 614 583 615 593 621C603 628 620 648 620 667Z" id="g50-103"></path><glyph.data ascent="3443" descent="-2856" horiz-adv-x="644" vert-adv-y="644"></glyph.data></g></svg> as a function of <svg height="12.5794pt" id="M92" style="vertical-align:-3.29107pt" version="1.1" viewbox="-0.0498162 -9.28833 21.9742 12.5794" width="21.9742pt" xmlns="http://www.w3.org/2000/svg" xmlns:xlink="http://www.w3.org/1999/xlink"><g transform="matrix(.013,0,0,-0.013,0,0)"><path d="M499 88L487 113C459 86 422 65 413 65C403 65 403 74 409 98L461 318C487 426 460 448 431 448C408 448 383 441 352 424C305 398 223 344 157 257H155L243 674C249 702 249 712 240 712C227 712 170 680 87 673L82 648H117C155 648 162 644 150 590L23 -4L30 -12C55 -4 81 3 105 8C113 53 131 150 143 187C199 281 323 387 372 387C390 387 393 369 380 311L328 86C313 19 319 -12 347 -12C379 -12 442 24 499 88Z" id="g113-105"></path><glyph.data ascent="3473" descent="-2876" horiz-adv-x="516" vert-adv-y="516"></glyph.data></g><g transform="matrix(.013,0,0,-0.013,6.708,0)"><path d="M368 703H309L44 -163H104L368 703Z" id="g113-48"></path><glyph.data ascent="3473" descent="-2876" horiz-adv-x="412" vert-adv-y="412"></glyph.data></g><g transform="matrix(.013,0,0,-0.013,12.069,0)"><path d="M393 379C402 394 400 411 393 422C384 437 365 448 348 448C301 448 237 372 186 285H182L193 335C210 408 205 448 178 448C150 448 80 402 29 344L45 321C80 355 114 373 122 373C128 373 130 365 124 330C106 228 76 98 50 -5L57 -12C82 -5 112 3 132 6L172 203C196 256 234 304 254 329C275 355 293 367 306 367C318 367 330 360 342 348C347 343 355 343 365 350S386 367 393 379Z" id="g113-115"></path><glyph.data ascent="3473" descent="-2876" horiz-adv-x="422" vert-adv-y="422"></glyph.data></g><g transform="matrix(.0091,0,0,-0.0091,16.97,3.132)"><path d="M452 282C452 397 389 451 302 451C268 451 227 441 188 422C95 377 24 281 24 154C24 65 70 -12 173 -12C240 -12 297 16 342 52C418 113 452 201 452 282ZM359 282C359 163 308 66 247 39C237 35 225 32 212 32C151 32 114 79 114 157C114 301 180 380 223 398C240 405 250 408 265 408C315 408 359 369 359 282Z" id="g50-112"></path><glyph.data ascent="3443" descent="-2856" horiz-adv-x="476" vert-adv-y="476"></glyph.data></g></svg> (<a href="https://static.hindawi.com/articles/jnm/volume-2015/843914/figures/#EEq4">4</a>).</div>

Journal of Nanomaterials

fig3

Figure 3

Figure 3: Effect of Micro- to Nanosize Inclusions upon the Thermal Conductivity of Powdered Composites with High and Low Interface Resistance 