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Journal of Nanomaterials
Volume 2015, Article ID 897142, 7 pages
http://dx.doi.org/10.1155/2015/897142
Research Article

Low-Temperature Sintering Bonding Using Silver Nanoparticle Paste for Electronics Packaging

1School of Mechanical Engineering and Automation, Beihang University, Beijing 100191, China
2School of Mechanical, Electronic, and Industrial Engineering, University of Electronic Science and Technology of China, Chengdu 611731, China
3Mechanical and Mechatronics Engineering, University of Waterloo, Waterloo, ON, Canada N2L 3G1

Received 22 January 2015; Revised 12 May 2015; Accepted 18 May 2015

Academic Editor: Changhong Ke

Copyright © 2015 Wei Guo et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

How to Cite this Article

Wei Guo, Zhi Zeng, Xiaoying Zhang, Peng Peng, and Shanping Tang, “Low-Temperature Sintering Bonding Using Silver Nanoparticle Paste for Electronics Packaging,” Journal of Nanomaterials, vol. 2015, Article ID 897142, 7 pages, 2015. https://doi.org/10.1155/2015/897142.