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Journal of Nanomaterials
Volume 2016 (2016), Article ID 3089716, 6 pages
Research Article

Thermal Conductivity of Composite Materials Containing Copper Nanowires

1College of Engineering, Shanghai Polytechnic University, Shanghai 201209, China
2College of Materials Science and Engineering, Donghua University, Shanghai 201620, China

Received 9 May 2016; Accepted 19 September 2016

Academic Editor: Stefano Bellucci

Copyright © 2016 Dahai Zhu et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


The development of thermal conductive polymer composite is necessary for the application in thermal management. In this paper, the experimental and theoretical investigations have been conducted to determine the effect of copper nanowires (CuNWs) and copper nanoparticles (CuNPs) on the thermal conductivity of dimethicone nanocomposites. The CuNWs and CuNPs were prepared by using a liquid phase reduction method, and they were characterized through scanning electron microscopy (SEM) and X-ray diffraction (XRD). The experimental data show that the thermal conductivity of composites increases with the increase of filler. With the addition of 10 vol.% CuNWs, the thermal conductivity of the composite is 0.41 W/m/K. The normalized thermal conductivity enhancement factor is 2.73, much higher than that of the analogue containing CuNPs (1.67). These experimental data are in agreement with Nan’s model prediction. Due to the high aspect ratio of 1D CuNWs, they can construct thermal networks more effectively than CuNPs in the composite, resulting in higher thermal conductivity.