Table of Contents Author Guidelines Submit a Manuscript
Journal of Nanomaterials
Volume 2016, Article ID 5284048, 8 pages
http://dx.doi.org/10.1155/2016/5284048
Research Article

Sintering Bonding Process with Ag Nanoparticle Paste and Joint Properties in High Temperature Environment

1Department of Mechanical Engineering, Tsinghua University, Beijing 100084, China
2Department of Aerospace and Mechanical Engineering, University of Southern California, Los Angeles, CA 90089, USA
3Department of Mechanical and Mechatronics Engineering, University of Waterloo, 200 University Avenue West, Waterloo, ON, Canada N2L 3G1

Received 4 November 2015; Revised 15 December 2015; Accepted 31 January 2016

Academic Editor: Jinting Jiu

Copyright © 2016 Jianfeng Yan et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Citations to this Article [8 citations]

The following is the list of published articles that have cited the current article.

  • Junjie Li, Tielin Shi, Xing Yu, Chaoliang Cheng, Jinhu Fan, Guanglan Liao, and Zirong Tang, “Low-Temperature and Low-Pressure Cu-Cu Bonding by Pure Cu Nanosolder Paste for Wafer-Level Packaging,” 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), pp. 976–981, . View at Publisher · View at Google Scholar
  • Chaoli Ma, Songbai Xue, Denzel Bridges, Zane Palmer, Zhili Feng, and Anming Hu, “Low temperature brazing nickel with Ag nanoparticle and Cu-Ag core-shell nanowire nanopastes,” Journal of Alloys and Compounds, 2017. View at Publisher · View at Google Scholar
  • Seyed Amir Paknejad, and Samjid H. Mannan, “Review of silver nanoparticle based die attach materials for high power/temperature applications,” Microelectronics Reliability, vol. 70, pp. 1–11, 2017. View at Publisher · View at Google Scholar
  • Ziyu Liu, Jian Cai, Qian Wang, Lei Liu, and Guisheng Zou, “Modified pulse laser deposition of Ag nanostructure as intermediate for low temperature Cu-Cu bonding,” Applied Surface Science, vol. 445, pp. 16–23, 2018. View at Publisher · View at Google Scholar
  • Ali Roshanghias, “Sinter bonding of inkjet-printed Ag die-attach as an alternative to Ag paste,” Journal of Materials Science: Materials in Electronics, 2018. View at Publisher · View at Google Scholar
  • Peter Frenzel, Susann Hausner, Marcus Korb, Guntram Wagner, and Heinrich Lang, “The Synthesis, Chemical and Physical Properties of Silver(I) Carboxylates and their Use in Copper-to-Copper Joining,” Inorganica Chimica Acta, 2018. View at Publisher · View at Google Scholar
  • Kwang-Ho Jung, Jungsoo Kim, Bum-Geun Park, Choong-Jae Lee, Hwan-Jin Sung, and Seung-Boo Jung, “Fabrication of Ag circuit embedded in PDMS substrate and its mechanical and electrical property with variations of photonic energy,” Journal of Alloys and Compounds, 2018. View at Publisher · View at Google Scholar
  • Ziyu Liu, Jian Cai, Qian Wang, Zheyao Wang, Lei Liu, and Guisheng Zou, “Thermal-stable void-free interface morphology and bonding mechanism of low-temperature Cu-Cu bonding using Ag nanostructure as intermediate,” Journal of Alloys and Compounds, vol. 767, pp. 575–582, 2018. View at Publisher · View at Google Scholar