Thermal Stresses Analysis and Optimized TTP Processes to Achieved CNT-Based Diaphragm for Thin Panel Speakers

Table 9

Taguchi-selected factors.

Factors		Level
		1	2	3
	Transfer area	1/2	3/4	1/1
	Stiffening pattern	Unidirectional	cross	angle
	Coating layers	No	1 layer	2 layers
	Transfer temperature	80°C	100°C	120°C