Influences of Bath Chemistry and Plating Variables on Characteristics of Electroless Ni–P Films on Si Wafers from Alkaline Citrate Solutions

Table 1

Bath composition and operation conditions for electroless Ni–P films.

Bath chemistry (g·L^−1)	Value	Plating variables	Value
NiSO4	15~50	pH	8~12
NaH2PO2	10~40	Temperature (, ^oC)	50~90
Na3C6H5O7	10~40	Time (, min)	15~90