Research Status of Evolution of Microstructure and Properties of Sn-Based Lead-Free Composite Solder Alloys

Figure 22

The morphology of solder alloys: (a) Sn-58Bi, (b) Sn-58Bi+0.5Al₂O₃, (c) Sn-58Bi+1.0Al₂O₃, and (d) Sn-58Bi+1.5Al₂O₃ [20].

(a)

(b)

(c)

(d)