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Colloidal Solution of Two-Dimensional Nanomaterials

Call for Papers

There has been a burst of worldwide research on two-dimensional (2D) nanomaterials since mid-2000, notably stimulated by successful preparation of graphene through the “scotch tape” method. 2D nanomaterials generally possess thickness of only one or a few atoms, while their in-plane dimension can be as large as several millimeters. The unique layered geometry has endowed 2D nanomaterials with desirable properties for advanced technologies with foreseeably huge market. In this regard, solution processing of corresponding bulk materials has been considered as a major route for high-volume production of 2D nanomaterials. In the solution processing, it is noteworthy that the unique properties of 2D nanomaterials are retained or maximized when they are dispersed as a single layer or few layers in solvents. Here, we refer to this type of solution as the colloidal solution of 2D materials. As the family of 2D nanomaterials is growing fast and their applications are broadening, more fundamental challenges related to such solution have been brought up.

This special issue will focus on recent fundamental research activities in the preparation, properties, and applications of the colloidal solution of 2D nanomaterials, including graphene, boron nitride, transition metal dichalcogenides, and other emerging 2D nanomaterials and their chemical derivatives. We cordially invite investigators to submit original research articles and review papers to the special issue.

Potential topics include but are not limited to the following:

  • Novel chemistry of colloidal solution of 2D nanomaterials, including novel precursors, solvents, and chemical reactions
  • Novel physical and physicochemical behaviors of 2D nanomaterials in colloidal solution, such as dispersion and assembly of 2D nanomaterials
  • Advancement in applications enabled by processes involving colloidal solution of 2D nanomaterials. Relevant applications include but are not limited to energy conversion and storage, sensors, and thermal interface materials
  • Modeling of fundamental problems involved in the aforementioned topics

Authors can submit their manuscripts through the Manuscript Tracking System at

Submission DeadlineFriday, 27 April 2018
Publication DateSeptember 2018

Papers are published upon acceptance, regardless of the Special Issue publication date.

Lead Guest Editor

  • Liyi Li, Intel Corporation, Hillsboro, USA

Guest Editors