Review Article
Importance of Molds for Nanoimprint Lithography: Hard, Soft, and Hybrid Molds
Table 1
Showing pros, cons, and research improvements for nanoimprint lithography based on hard mold, soft mold, and hybrid molds.
| Lithography types | Example | Pros | Cons | Improvements |
| Hard mold | Silicon, Quartz | High resolution (<100 nm), high chemical stability, high mechanical strength for high aspect -ratio features | Low defect accommodation, high-cost, breakage of the mold during demolding, difficult fabrication process for the working molds | Use of blade for demolding to minimize the breakage of the molds, use of hydrophobic silane layers to coat the molds to avoid accumulation of resist |
| Soft mold | ETFE, PDMS, PFPE, PET | Generous defect accommodation, easiness of fabricating working molds, flexibility for nonflat surface, high chemical stability, cost-effectiveness | Low resolution (>150 nm), relatively low mechanical strength for high aspect -ratio features | Development of various types of functional polymers in order to enhance the mechanical strength and chemical stability for resolution improvement |
| Hybrid mold | MINS, Ormostamp, I-UVM-100 | Combination of advantages of hard and soft molds | Relatively longer fabrication process compared to soft working molds | Introduction of the hydrophobic silane chain to the molds in order to reduce coating time to avoid resist accumulation |
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