Procedures and Properties for a Direct Nano-Micro Integration of Metal and Semiconductor Nanowires on Si Chips
Figure 4
(a) Optical image of a microstructured photoresist film consisting of several microchips on a silicon wafer and a magnified view of a microchip. After UV lithography, each individual chip (b) consists of an open area for the later installed contact lines on the SiO2 and a 10 μm wide rectangle of photoresist (c), where the nanowires will be installed. (d) Part of a chip cut from a chip design. (e) An optical micrograph of the 10 μm wide and 200 μm long photoresist after it is thermally fractured in liquid nitrogen—a periodic pattern of cracks occur. The cracks in (e) are observable optically as they are bended upwards because of the debonding of the resist from the substrate and causing it a delamination.
