Impact of Bundle Structure on Performance of on-Chip CNT Interconnects

Table 1

Sizing ratio used for simulation study.

Year	2012	2013	2014	2015	2016	2017	2018	2019	2020	2021	2022
Width (nm)	36	32	28	25	22	20	18	16	14	13	11
Delay of the copper (ps/um)	0.85	1.13	1.56	1.79	2.48	3.12	3.66	4.98	7.11	7.27	11.44