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Journal of Nanotechnology
Volume 2015, Article ID 612617, 10 pages
Research Article

Fabrication of Surface Level Cu/SiCp Nanocomposites by Friction Stir Processing Route

Department of Mechanical Engineering, Pondicherry Engineering College, Pondicherry 605 014, India

Received 23 July 2015; Revised 8 November 2015; Accepted 9 November 2015

Academic Editor: Paresh Chandra Ray

Copyright © 2015 Cartigueyen Srinivasan and Mahadevan Karunanithi. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


Friction stir processing (FSP) technique has been successfully employed as low energy consumption route to prepare copper based surface level nanocomposites reinforced with nanosized silicon carbide particles (SiCp). The effect of FSP parameters such as tool rotational speed, processing speed, and tool tilt angle on microstructure and microhardness was investigated. Single pass FSP was performed based on Box-Behnken design at three factors in three levels. A cluster of blind holes 2 mm in diameter and 3 mm in depth was used as particulate deposition technique in order to reduce the agglomeration problem during composite fabrication. K-type thermocouples were used to measure temperature histories during FSP. The results suggest that the heat generation during FSP plays a significant role in deciding the microstructure and microhardness of the surface composites. Microstructural observations revealed a uniform dispersion of nanosized SiCp without any agglomeration problem and well bonded with copper matrix at different process parameter combinations. X-ray diffraction study shows that no intermetallic compound was produced after processing. The microhardness of nanocomposites was remarkably enhanced and about 95% more than that of copper matrix.