Journal of Sensors / 2014 / Article / Fig 7

Research Article

Analysis on Structural Stress of 64 × 64 InSb IRFPAs with Temperature Dependent Elastic Underfill

Figure 7

Mises stress distribution with 64 × 64 arrays for InSb chip: (a) top and (b) bottom surface.
952323.fig.007a
(a)
952323.fig.007b
(b)