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Journal of Sensors
Volume 2016, Article ID 4046061, 8 pages
Review Article

Intelligent Packaging Systems: Sensors and Nanosensors to Monitor Food Quality and Safety

1Industrial Engineering Department, University of Santiago de Chile, Avenida Ecuador 3769, Santiago de Chile, Chile
2Facultad de Ciencias Económicas y Administrativas, Universidad Central de Chile, Lord Cochrane 417, Santiago de Chile, Chile
3Electrical Engineering Department, University of Santiago de Chile, Avenida Ecuador 3519, Santiago de Chile, Chile
4Facultad de Ingenieria, Universidad Andres Bello, Antonio Varas 880, Santiago de Chile, Chile
5Departamento de Matemáticas y Física, Facultad de Ingeniería y Administración, Universidad Bernardo O’Higgins, Avenida Viel 1497, Ruta 5 Sur, Santiago de Chile, Chile
6Faculty of Management and Economics, University of Santiago de Chile, Avenida Libertador Bernardo O’Higgins 3363, Santiago de Chile, Chile

Received 29 April 2016; Accepted 18 September 2016

Academic Editor: Stephane Evoy

Copyright © 2016 Guillermo Fuertes et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


The application of nanotechnology in different areas of food packaging is an emerging field that will grow rapidly in the coming years. Advances in food safety have yielded promising results leading to the development of intelligent packaging (IP). By these containers, it is possible to monitor and provide information of the condition of food, packaging, or the environment. This article describes the role of the different concepts of intelligent packaging. It is possible that this new technology could reach enhancing food safety, improving pathogen detection time, and controlling the quality of food and packaging throughout the supply chain.