Table of Contents Author Guidelines Submit a Manuscript
Journal of Sensors
Volume 2018, Article ID 1953528, 10 pages
https://doi.org/10.1155/2018/1953528
Research Article

Feasibility Study of Interlayer Slide Monitoring Using Postembedded Piezoceramic Smart Aggregates

1Key Laboratory of Earthquake Geodesy, Institute of Seismology, China Earthquake Administration, Wuhan 430071, China
2Department of Mechanical Engineering, University of Houston, Houston, TX 77204, USA
3Department of Civil and Environmental Engineering, University of Houston, Houston, TX 77204, USA

Correspondence should be addressed to Gangbing Song; ude.hu@gnosg

Received 10 August 2017; Accepted 3 January 2018; Published 25 March 2018

Academic Editor: Yinan Zhang

Copyright © 2018 Jianchao Wu et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Citations to this Article [4 citations]

The following is the list of published articles that have cited the current article.

  • Jianchao Wu, Weijie Li, and Qian Feng, “Electro-Mechanical Impedance (EMI) Based Interlayer Slide Detection Using Piezoceramic Smart Aggregates—A Feasibility Study,” Sensors, vol. 18, no. 10, pp. 3524, 2018. View at Publisher · View at Google Scholar
  • Ning Li, Furui Wang, and Gangbing Song, “New Entropy-based Vibro-acoustic Modulation Method for Metal Fatigue Crack Detection: An Exploratory Study,” Measurement, pp. 107075, 2019. View at Publisher · View at Google Scholar
  • Chien-Kuo Chiu, Wen-I Liao, and Adrian Hartono, “Study on the application of post-embedded piezoceramic transducers for crack detection on earthquake-damaged RC columns,” Smart Materials and Structures, vol. 28, no. 5, pp. 055039, 2019. View at Publisher · View at Google Scholar
  • Zijian Wang, Li Wei, and Maosen Cao, “Damage Quantification with Embedded Piezoelectric Aggregates Based on Wavelet Packet Energy Analysis,” Sensors, vol. 19, no. 2, pp. 425, 2019. View at Publisher · View at Google Scholar