Research and development in advanced sensors with embedded monitoring capability have experienced significant growth in recent years, fueled by their broad applications in real-time measurement of a wide variety of physical, chemical, and biological quantities. Compared with conventional sensors with bulky assemblies, recent progress in 3D manufacturing technologies (e.g., ultrafast laser micromachining and additive manufacturing) has opened up a new avenue in one-step fabrication of assembly-free micro devices in various materials as well as the development of compact, customized, and intricate smart structures/components. The merits of these advanced manufacturing techniques enable the integration of embeddable advanced sensors into smart structures/components for improved robustness, enriched functionality, enhanced intelligence, and unprecedented performance.

This special issue seeks to attract researchers to contribute their original research articles as well as review articles that will further improve the performance of advanced sensors. Particular focus is placed on smart parts (advanced sensors and smart structures/components) to address the monitoring needs within extreme environment conditions such as high temperature, high pressure, corrosive/erosive atmosphere, and large strain/stress. A well-chosen real practical application example, based on novel methods and/or known methods to new fields, will also be considered. Both experimental and theoretical/simulated results are welcome to this special issue.

Potential topics include, but are not limited to:

• Embeddable fiber optic/coaxial cable/piezoelectric sensors
• Additive manufacturing for smart structures fabrication and sensor embedment
• Smart structures and sensor packaging method
• Performance testing of smart structures and embedded sensors
• (FEM) on the design of advanced sensors
• Sensing applications in harsh environment
• Instruments and instrumentations for sensing applications
• Ultrafast laser micromachining and mechanism of light-material interaction
• Microwave interrogation technology