Laser-Induced Backside Wet Etching of Transparent Materials with Organic and Metallic Absorbers
Figure 2
SEM images of etched square patterns in fused silica with
by 248 nm excimer laser: (a)
H-LIBWE with py:toluene (300 pulses at 1.4 J/) and (b) M-LIBWE
with Ga (30 pulses at 3.4 J/).
