Research Article
Investigation of Novel Noncontacting Measurement Method by the Design of Loop-Type Probe and Reconstruction of Radiation Modeling
Table 3
Material thickness information.
| Copper | Material |
| Layer 1 | Pad | 0.043 mm | Solder mask | 0.053 mm | Layer 2 | Loop | 0.035 mm | PP glue | 0.15 mm | Layer 3 | DUT | 0.035 mm |
Substrate (FR4) | 0.7 mm | Layer 4 | GND | 0.043 mm | Plated copper | 0.025 mm |
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