Research Article

Investigation of Novel Noncontacting Measurement Method by the Design of Loop-Type Probe and Reconstruction of Radiation Modeling

Table 3

Material thickness information.

CopperMaterial

Layer 1Pad0.043 mmSolder mask0.053 mm
Layer 2Loop0.035 mmPP glue0.15 mm
Layer 3DUT0.035 mm Substrate (FR4)0.7 mm
Layer 4GND0.043 mmPlated copper0.025 mm