Table of Contents Author Guidelines Submit a Manuscript

Mathematical Problems in Packaging Engineering

Call for Papers

Modern packaging plays an important role in modern industry. There are more than 60.000 scientists conducting research related to packaging engineering. This special issue aims at gathering the research and development of mathematical modeling and computation methods which are applied into packaging engineering. Papers submitted to this special issue will contribute to the application of mathematical methods and models or should be the representative study in the field of packaging research. Every year, we are planning to invite several leading packaging scientists to submit original research and review articles that seek mathematical modeling and simulation in packaging engineering. Potential topics include, but are not limited to:

  • Novel mathematical modeling of packaging system
  • Asymptotic methods for coupled nonlinear differential equations/partial differential equations arising in packaging system
  • Fractional differential equations with applications in packaging system
  • Mathematical modeling of the mass, heat transfer phenomenon for product/packaging/human/environment interaction
  • Differential geometry with applications in packaging machinery and atomization
  • Mathematical problems in smart packaging, active packaging, and new-developed food packaging technology

Before submission authors should carefully read over the journal's Author Guidelines, which are located at Prospective authors should submit an electronic copy of their complete manuscript through the journal Manuscript Tracking System at according to the following timetable:

Manuscript DueFriday, 17 May 2013
First Round of ReviewsFriday, 9 August 2013
Publication DateFriday, 4 October 2013

Guest Editors

  • Jun Wang, Department of Packaging Engineering of Jiangnan University, Wuxi 214122, China
  • Changfeng Ge, Manufacturing & Mechanical Engineering Technology/Packaging Science of Rochester Institute of Technology, Rochester, NY 14623-5603, USA
  • Dong Sun Lee, Department of Food Science and Biotechnology, Kyungnam University, Changwon 631-701, Republic of Korea
  • Michael A. Sek, School of Engineering and Science, Victoria University (VU), Melbourne, VIC 8001, Australia
  • Vanee Chonhenchob, Department of Packaging and Materials Technology, Faculty of Agro- Industry, Kasetsart University, Bangkok 10900, Thailand