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Scientific Programming towards a Smart World

Call for Papers

In the past several years, we have seen dramatic advancement in many application domains enabled by integration of Internet of Things and cloud computing, computational intelligence algorithms, and soft computing methodologies. This development has resulted in many emerging highly multidisciplinary research areas typically termed as smart-* technologies and systems, including smart-healthcare, smart-home, and smart-grid, as well as smart vehicles and intelligent transportation systems. These new technologies are transforming our society towards a smart world.

In this special issue, we invite original research articles on the research and development in all areas of programming and software engineering for the integration of Internet of Things and cloud computing towards a smart world.

This special issue also welcomes articles reporting fundamental research on scientific programing that enables and facilitates new smart technologies in any of the above application domains or in other areas that we have yet to see.

Potential topics include but are not limited to the following:

  • Integration of Internet of Things and cloud computing
  • Cloud-based mobile services
  • Human-computer interactions in pervasive computing
  • Computational intelligence in big data processing towards a smart world
  • Soft computing and smart technologies in fault diagnostics and health monitoring of cloud systems
  • Security, reliability, and fault tolerance in pervasive and cloud computing
  • Smart world applications, such as smart manufacturing, smart energy, smart and connected health, smart home, and intelligent transportation systems

Authors can submit their manuscripts through the Manuscript Tracking System at http://mts.hindawi.com/submit/journals/sp/sptsw/.

Manuscript DueFriday, 23 September 2016
First Round of ReviewsFriday, 16 December 2016
Publication DateFriday, 10 February 2017

Lead Guest Editor

Guest Editors

  • Xiong Luo, University of Science and Technology Beijing, Beijing, China
  • Huaping Liu, Tsinghua University, Beijing, China
  • Kun Hua, Lawrence Technological University, Southfield, USA
  • Chaomin Luo, University of Detroit Mercy, Detroit, USA