Table of Contents Author Guidelines Submit a Manuscript
Shock and Vibration
Volume 4, Issue 3, Pages 169-191
http://dx.doi.org/10.3233/SAV-1997-4304

Shock Protection of Portable Electronic Products: Shock Response Spectrum, Damage Boundary Approach, and Beyond

Suresh Goyal,1 Jim M. Papadopoulos,2 and Paul A. Sullivan3

1Wireless Research Laboratory, Lucent Technologies, Bell Laboratories, 600 Mountain Avenue, Rm. 1B-212, Murray Hill, NJ 07974, USA
2Rexnord Technical Services, 5101 West Beloit Road, West Milwaukee, WI 53214, USA
3Wireless Research Laboratory, Lucent Technologies, Bell Laboratories, 600 Mountain Avenue, Rm. 1C-326, Murray Hill, NJ 07974, USA

Revised 8 August 1996; Accepted 2 January 1997

Copyright © 1997 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Citations to this Article [15 citations]

The following is the list of published articles that have cited the current article.

  • Z. Y. Zhu, H. P. Lee, and B. T. Cheok, “Finite Element Analysis of Mechanical Shock Responses of RF Connectors,” Journal of Electronic Packaging, vol. 125, no. 1, pp. 144, 2003. View at Publisher · View at Google Scholar
  • Jg Kim, and Yk Park, “Experimental verification of drop/impact simulation for a cellular phone,” Experimental Mechanics, vol. 44, no. 4, pp. 375–380, 2004. View at Publisher · View at Google Scholar
  • Zhongping Bao, Suresh Goyal, Liang-Jenq Leu, and Subrata Mukherjee, “The Role of Beam Flexibility and Ground Contact Model in the Clattering of Deformable Beams,” Journal of Dynamic Systems, Measurement, and Control, vol. 126, no. 2, pp. 421, 2004. View at Publisher · View at Google Scholar
  • E. Suhir, M. Vujosevic, and T. Reinikainen, “Nonlinear dynamic response of a 'flexible-and-heavy' printed circuit board (PCB) to an impact load applied to its support contour,” Journal of Physics D-Applied Physics, vol. 42, no. 4, 2009. View at Publisher · View at Google Scholar
  • E. Suhir, and L. Arruda, “The coordinate function in the problem of the nonlinear dynamic response of an elongated printed circuit board (PCB) to a drop impact applied to its supports,” European Physical Journal-Applied Physics, vol. 48, no. 2, 2009. View at Publisher · View at Google Scholar
  • Bryan Rodgers, Suresh Goyal, Gerard Kelly, and Michael Sheehy, “The dynamics of multiple pair-wise collisions in a chain for designing optimal shock amplifiers,” Shock and Vibration, vol. 16, no. 1, pp. 99–116, 2009. View at Publisher · View at Google Scholar
  • E. Suhir, “Predictive Modeling of the Dynamic Response of Electronic Systems to Shocks and Vibrations,” Applied Mechanics Reviews, vol. 63, no. 5, 2010. View at Publisher · View at Google Scholar
  • Mahmoud I. Ibrahim, Mohammad I. Younis, and Fadi Alsaleem, “An investigation into the effects of electrostatic and squeeze-film non-linearities on the shock spectrum of microstructures,” International Journal of Non-Linear Mechanics, vol. 45, no. 8, pp. 756–765, 2010. View at Publisher · View at Google Scholar
  • Gerard Kelly, Jeff Punch, Suresh Goyal, and Michael Sheehy, “Shock pulse shaping in a small-form factor velocity amplifier,” Shock and Vibration, vol. 17, no. 6, pp. 787–802, 2010. View at Publisher · View at Google Scholar
  • M. R. Brake, “An inverse shock response spectrum,” Mechanical Systems and Signal Processing, vol. 25, no. 7, pp. 2654–2672, 2011. View at Publisher · View at Google Scholar
  • Jun Wang, Zhi-Wei Wang, Li-Xin Lu, Yong Zhu, and Yong-Guang Wang, “Three-dimensional shock spectrum of critical component for nonlinear packaging system,” Shock and Vibration, vol. 18, no. 3, pp. 437–445, 2011. View at Publisher · View at Google Scholar
  • Minsu Kim, and Suk Joo Bae, “Drop fragility of the display of a smart mobile phone: weakest link failure or cumulative shock failure?,” IIE Transactions, vol. 46, no. 10, pp. 1079–1092, 2014. View at Publisher · View at Google Scholar
  • Stuart T. Douglas, Moustafa Al-Bassyiouni, and Abhijit Dasgupta, “Experiment and Simulation of Board Level Drop Tests With Intentional Board Slap at High Impact Accelerations,” Ieee Transactions on Components Packaging and Manufacturing Technology, vol. 4, no. 4, pp. 569–580, 2014. View at Publisher · View at Google Scholar
  • Jing Qian, Heping Cai, Weiwei Ma, and Zhiwei Hao, “Shock Analysis on a Packaged Washing Machine from Damage Boundary: Shock Response Spectrum to Component Failure,” Shock and Vibration, vol. 2015, pp. 1–7, 2015. View at Publisher · View at Google Scholar
  • Ningning Duan, Meng Hao, and Anjun Chen, “Damage Evaluation of Critical Components of Tilted Support Spring Nonlinear System under a Rectangular Pulse,” Mathematical Problems in Engineering, vol. 2015, pp. 1–9, 2015. View at Publisher · View at Google Scholar