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Shock and Vibration
Volume 2016, Article ID 4836516, 13 pages
Research Article

Experimental Investigation into Vibration Characteristics for Damage Minimization in a Lapping Process

1Advanced Automation and Electronics Research Unit, National Electronics and Computer Technology Center, Pathum Thani 12120, Thailand
2Western Digital (Thailand) Co., Ltd., Ayutthaya 13160, Thailand

Received 21 December 2015; Revised 9 February 2016; Accepted 14 February 2016

Academic Editor: Arturo Garcia-Perez

Copyright © 2016 J. Suwatthikul et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Citations to this Article [1 citation]

The following is the list of published articles that have cited the current article.

  • Savas Ozturk, Levent Aydin, Nilay Kucukdogan, and Erdal Celik, “Optimization of lapping processes of silicon wafer for photovoltaic applications,” Solar Energy, vol. 164, pp. 1–11, 2018. View at Publisher · View at Google Scholar