Shock and Vibration

Advances in Vibration Signal Time-Frequency Analysis for Defect Detection 2021

Publishing date
01 Feb 2022
Submission deadline
17 Sep 2021

Lead Editor

1Donghua University, Shanghai, China

2Shanghai University, Shanghai, China

3University of Toronto, Toronto, Canada

This issue is now closed for submissions.

Advances in Vibration Signal Time-Frequency Analysis for Defect Detection 2021

This issue is now closed for submissions.


Time-frequency analysis is a powerful tool for analyzing time-varying non-stationary signals, which has become a popular topic in modern signal processing research. Time-frequency analysis can express the signal in time and frequency at the same time, so that the signal features that are difficult to get in time domain can be displayed clearly in time-frequency domain, which has an excellent application prospect in defect detection.

Time-frequency analysis is a very important signal processing technology, however, there are some defects in current time-frequency analysis methods, such as modal aliasing end effect. Therefore, it is important to study new time-frequency analysis methods and their applications in defect detection.

To rapidly report and spread the latest advancements in the science of vibration signal time-frequency analysis for defect detection, this Special Issue intends to publish original research and review articles on all aspects of theoretical and applied investigations about vibration signal time-frequency analysis for defect detection. The defects include cracks, wear and tear of mechanical devices, and so on. We welcome articles that focus on new time-frequency analysis methods for intelligent detection, adaptive time-frequency analysis method, new time-frequency image analysis method and their application in defect detection, and so on, original research studies and review articles related to the above themes are encouraged.

Potential topics include but are not limited to the following:

  • New time-frequency analysis method for intelligent detection
  • Time-frequency analysis for defect detection in a mechanical device
  • Adaptive time-frequency analysis method
  • New time-frequency image analysis method
  • Defect detection system based on vibration signal time-frequency analysis
Shock and Vibration
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Acceptance rate30%
Submission to final decision86 days
Acceptance to publication23 days
Journal Citation Indicator0.400
Impact Factor1.6

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