Table of Contents
Textures and Microstructures
Volume 13, Issue 2-3, Pages 155-164
http://dx.doi.org/10.1155/TSM.13.155

Effects of Deposition Conditions on Texture in Copper Thin Films on Si (111)

1Materials Engineering Department, Center for Integrated Electronics, Rensselaer Polytechnic Institute, Troy, NY 12180–3590, USA
2Physics Department, Center for Integrated Electronics, Rensselaer Polytechnic Institute, Troy, NY 12180–3590, USA

Copyright © 1991 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Citations to this Article [9 citations]

The following is the list of published articles that have cited the current article.

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