Table of Contents
Textures and Microstructures
Volume 19 (1992), Issue 4, Pages 211-227
http://dx.doi.org/10.1155/TSM.19.211

Modelling High Temperature Rolling Textures of FCC Metals

1CRV SA, BP 27, 38340 Voreppe, France
2Ecole des Mines, Département Matériaux, 158 Cours Fauriel, Saint-Etienne Cedex 2 42023, France
3Institute for General Physics, Eötvös University, P.O.B. 323, Budapest 1445, Hungary

Received 12 March 1992

Copyright © 1992 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Abstract

A partially relaxed constraints grain deformation model is proposed to explain the influence of temperature on the rolling textures of fcc metals. The effects of the grain plastic shear in the TD/RD plane and the role of the rate sensitivity of crystallographic slip on the evolution of the texture have been investigated by numerical simulations for a random initial texture. The rate sensitivity and the TD/RD shear are assumed to increase with temperature. The progression from the Copper {112}<111> component towards Brass {110}<112> and S {123}<634> type textures is predicted at higher values of the rate sensitivity and the TD/RD shear. These model predictions compare well with published hot rolling textures of aluminium alloys. The concept of grain shear partial relaxation has been validated by room and high temperature channel die tests on {110}<112> oriented Al crystals constrained between aluminium polycrystals.