Table of Contents
Textures and Microstructures
Volume 20 (1993), Issue 1-4, Pages 217-230
http://dx.doi.org/10.1155/TSM.20.217

Measurement of Interface Damage Heterogeneity

1Alcoa Technical Center, Alcoa Center, PA, USA
2Brigham Young University, Provo, UT, USA

Copyright © 1993 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Citations to this Article [2 citations]

The following is the list of published articles that have cited the current article.

  • A. A. Telang, T. T. Bieler, S. Choi, and K. K. Subramanian, “Orientation imaging studies of Sn-based electronic solder joints,” Journal of Materials Research, vol. 17, no. 09, pp. 2294–2306, 2011. View at Publisher · View at Google Scholar
  • D. P. Field, H. Weiland, and K. Kunze, “Intergranular Cracking in Aluminum Alloys,” Canadian Metallurgical Quarterly, vol. 34, no. 3, pp. 203–210, 2013. View at Publisher · View at Google Scholar