Texture, Stress, and Microstructure

Texture, Stress, and Microstructure / 1995 / Article

Open Access

Volume 23 |Article ID 764568 | https://doi.org/10.1155/TSM.23.237

N. Mingolo, C. Vial-Edwards, "Description of Texture and Yield Locus Evolution Under Different Deformation Paths of Copper Sheet", Texture, Stress, and Microstructure, vol. 23, Article ID 764568, 12 pages, 1995. https://doi.org/10.1155/TSM.23.237

Description of Texture and Yield Locus Evolution Under Different Deformation Paths of Copper Sheet

Received13 Mar 1995


The evolution of texture with plastic deformation along different loading paths has been studied for a commercial DHP copper sheet metal. Two models have been utilized to predict the evolution of textures: Viscoplastic under Relaxed Constraints conditions (VRC) and a Self Consistent approach (SC) with viscoplastic conditions, where the {111}<110> active slip systems were selected according to a strain rate sensitivity law.The stress-strain curves along different loading paths were calculated taking into account the texture evolution predicted by VRC and SC models. Predictions with the SC formulation were very close to experimental results. Texture evolution depended on the deformation path.

Copyright © 1995 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

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