Table of Contents
Textures and Microstructures
Volume 23 (1995), Issue 4, Pages 237-248
http://dx.doi.org/10.1155/TSM.23.237

Description of Texture and Yield Locus Evolution Under Different Deformation Paths of Copper Sheet

1Depto. Materiales, Gerencia Desarrollo, CNEA, Av. Libertador 8250, Buenos Aires 1429, Argentina
2Escuela de Ingeniería, Pontificia Universidad Católica de Chile, Vicuña Mackenna, Santiago 4860, Chile

Received 13 March 1995

Copyright © 1995 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Abstract

The evolution of texture with plastic deformation along different loading paths has been studied for a commercial DHP copper sheet metal. Two models have been utilized to predict the evolution of textures: Viscoplastic under Relaxed Constraints conditions (VRC) and a Self Consistent approach (SC) with viscoplastic conditions, where the {111}<110> active slip systems were selected according to a strain rate sensitivity law.

The stress-strain curves along different loading paths were calculated taking into account the texture evolution predicted by VRC and SC models. Predictions with the SC formulation were very close to experimental results. Texture evolution depended on the deformation path.