Table of Contents
Textures and Microstructures
Volume 34 (2000), Issue 2-3, Pages 181-195
http://dx.doi.org/10.1155/TSM.34.181

The Evolution of Texture During Annealing of Nanocrystalline Electroless Nickel Alloy Deposits

1School of Materials Science and Engineering, Seoul National University, Seoul 151-742, Korea
2Materials Research Laboratory, R & D Center, Samsung ElectroMechanics, Suwon 442-743, Korea

Received 8 October 1999

Copyright © 2000 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Abstract

The electroless Ni–Co–P alloy films containing up to 13.4% Co and 7.6% P were deposited on a 5086 aluminum alloy sheet using baths consisting of NiSO4, CoSO4, (NH4)2SO4, NaH2PO2, sodium citrate and thiourea. The deposits were solid solutions having a grain size of 6–7 nm and strong 111 texture. When the deposits were annealed for 2 h, Ni5P2 was precipitated at 325°C and transformed into the stable Ni3P phase at higher temperatures. During annealing the texture of deposit changed from 111 to 100. The texture change was attributed to preferential growth of 100 grains at the expense of 111 grains to decrease the thermal strain energy of the deposits. On the other hand, the electroless Ni–Cu–P alloy films containing Cu and P deposited on 5086 aluminum alloy sheet had the microstructures and textures which are similar to these of the Ni–Co–P alloy films. However, their initial 111 texture remained relatively stable even after annealing. The differences in annealing textures of Ni–Co–P and Ni–Cu–P alloy films have been discussed.