The electroless Ni–Co–P alloy films containing up to 13.4% Co and 7.6% P were
deposited on a 5086 aluminum alloy sheet using baths consisting of NiSO4, CoSO4,
(NH4)2SO4, NaH2PO2, sodium citrate and thiourea. The deposits were solid solutions
having a grain size of 6–7 nm and strong 〈111〉 texture. When the deposits were annealed
for 2 h, Ni5P2 was precipitated at 325°C and transformed into the stable Ni3P phase at
higher temperatures. During annealing the texture of deposit changed from 〈111〉 to 〈100〉.
The texture change was attributed to preferential growth of 〈100〉 grains at the expense of
〈111〉 grains to decrease the thermal strain energy of the deposits. On the other hand, the
electroless Ni–Cu–P alloy films containing Cu and P deposited on 5086 aluminum alloy
sheet had the microstructures and textures which are similar to these of the Ni–Co–P
alloy films. However, their initial 〈111〉 texture remained relatively stable even after
annealing. The differences in annealing textures of Ni–Co–P and Ni–Cu–P alloy films
have been discussed.