David B. Knorr

J&#xFC;rgen Hirsch

Editorial

Texture measurements in polycrystalline 123 oxide superconductors are complicated by the superposition
of Bragg reflections in the pole figures due to the near degeneracy of the crystal structure. A
method is described, based on an extension of the WIMV algorithm, for resolving these
superpositions and determining the crystal orientation distribution (OD). The method is exemplified
by OD analysis of a magnetically aligned, strongly textured powder sample of YBa2Cu3O7.

John S. Kallend

R. B. Schwarz

A. D. Rollett

Resolution of Superimposed
Diffraction Peaks in Texture Analysis
of a YBa2Cu3O7 Polycrystal

Advantages of using single orientations measurements over the traditional bulk measurement using
pole figures are: direct access to odd-l terms in the series expansion of the Orientation Distribution
Function (ODF) (Bunge, 1982) and the capability to measure local textures and to obtain spatial
orientation correlation information. The primary obstacle to the use of single orientation measurements
is the large investment of direct operator time required to obtain a statistically reliable data set.
This study examines a technique that has been developed to automate the orientation identification
process. The technique essentially compares an electron backscattered Kikuchi diffraction (BKD)
pattern with a set of idealized patterns and finds the best match. The set of idealized patterns is
created from a set of orientations which represent a tessellation of the asymmetric region of Euler
space. The technique shows promising preliminary results, BKD patterns for silicon and stainless steel
were correctly identified by the computer.

Stuart I. Wright

Jun-Wu Zhao

Brent L. Adams

Automated Determination of Lattice
Orientation From Electron
Backscattered Kikuchi
Diffraction Patterns

The rolling deformation has widely been considered equivalent to plane strain compression. The
validity of this presumption, particularly at high strains, was tested by comparing the deformation and
recrystallization textures in rolled and channel-die compressed copper using the ODF techniques.
Noticeable differences were observed in both the deformation and recrystallization (cube) textures of
the strips produced by these two deformation methods. For the deformation texture, the rolled strip
shows stronger &#x201C;copper&#x201D; and &#x201C;S&#x201D;, but weaker &#x201C;brass&#x201D; components, in comparison with the
channel-die compressed strip. For the recrystallized specimens, the cube texture is stronger in the
rolled than in the channel-die compressed specimens, and their microstructures are also noticeably
different. These observed differences are all more prominent at higher reductions. The causes of these
differences will be discussed.

H. Hammelrath

J. F. Butler

D. Juul-Jensen

T. Leffers

Hsun Hu

K. L&#xFC;cke

An ODF Study of the Deformation and
Recrystallization Textures of Rolled
and Channel-die Compressed
High Purity Copper

The texture of copper films deposited on bare Si (111) is studied using a partially ionized beam
deposition technique. A change in deposition parameters (percent ions and substrate bias) radically
alters the texture from epitaxial to fiber. Under conditions indicative of deposition by evaporation, a
sharp texture typified by a Cu &#x7B;531&#x7D; &#x2016; Si (111) relationship is observed. At measurable ion energy
levels, the film texture becomes Cu (111). A narrowly defined set of conditions promotes epitaxy
which breaks down into a fiber texture for conditions of successively higher ion energy. The role of
internal (boundary) energy and interfacial (substrate/film and film/ambient) energy are discussed.

D. B. Knorr

T.-M. Lu

Effects of Deposition Conditions on
Texture in Copper Thin
Films on Si (111)

Semicrystalline polypropylene samples with high concentrations of crystallinity (&#x2273;62&#x25;) are deformed
in uniaxial compression at different temperatures and different strain rates. The orientation changes of
the crystalline part of the material are analyzed using X-ray diffraction methods. Pole figure
evaluation is used to obtain information about the crystal structure, the geometry of slip, and its
correlation with the characteristic of strength evolution in polymers. The contribution of the
crystalline part of the material to plastic flow is estimated and the textures are related to the
characteristic effects in plastic and visco-elastic response of the material during deformation and
subsequent stress relaxation. The observed texture effects can be explained by the rotation of
crystallographic c-axis (backbone axis) normal to the compression direction at high temperatures in a
planar slip mode. The stress/strain and relaxation behavior of the material is interpreted as a
combination of viscoelastic flow of amorphous volume and irreversible plastic flow of the crystalline
part which contributes to an orientation dependence of deformation and stress relaxation.

J. R. Hirsch

P. T. Wang

Texture and Strength Evolution in
Deformed Polypropylene

The texture changes in tube reduced (60&#x25;) and stress relieved Zr-1 wt&#x25;Nb nuclear fuel sheathing on
annealing at temperatures from 300&#x2013;1100&#x2103; for 104 seconds have been measured using an X-ray
inverse pole figure technique. These changes in texture are then related to changes in both mechanical
anisotropy as determined using Knoop microhardness measurements and microstructure as seen using
optical metallography. Changes in texture and anisotropy arise both from recrystallization and phase
changes, with major texture changes only occurring at temperatures where there is a phase
transformation to &#x3B2;Zr.

Derek O. Northwood

John W. Robinson

Zheng Jie

Microstructure and Texture
Evolution During the Annealing
of Cold-worked Zr-1 wt&#x25;Nb

Extensive studies of the microstructure of deposited films establish that grain boundary migration is a
ubiquitous process in the development of microstructure and frequently the key process in the
formation of a preferred orientation. This conclusion is supported by the interpretation of
observations of the structure and orientation of films as a function of substrate temperature and post
deposition annealing. Epitaxial deposits can result from oriented nucleation or selective growth
processes. On amorphous substrates the anisotropy of the interfacial energies of the deposit results in
a fiber texture at temperatures when grain growth occurs either during deposition or in a
post-deposition anneal.

Idajean M. Fisher

David A. Smith

Grain Boundary Migration and the
Texture of Films

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Texture, Stress, and Microstructure

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Papers are published upon acceptance, regardless of the Special Issue publication date.

Texture, Stress, and Microstructure

Proceeding From the Symposia Textures in Non-metallic Materials

Proceeding From the Symposia Textures in Non-metallic Materials

Articles

Editorial

Resolution of Superimposed Diffraction Peaks in Texture Analysis of a YBa₂Cu₃O₇ Polycrystal

Automated Determination of Lattice Orientation From Electron Backscattered Kikuchi Diffraction Patterns

An ODF Study of the Deformation and Recrystallization Textures of Rolled and Channel-die Compressed High Purity Copper

Effects of Deposition Conditions on Texture in Copper Thin Films on Si (111)

Texture and Strength Evolution in Deformed Polypropylene

Microstructure and Texture Evolution During the Annealing of Cold-worked Zr-1 wt%Nb

Grain Boundary Migration and the Texture of Films

Texture, Stress, and Microstructure

Proceeding From the Symposia Textures in Non-metallic Materials

Proceeding From the Symposia Textures in Non-metallic Materials

Articles

Editorial

Resolution of Superimposed Diffraction Peaks in Texture Analysis of a YBa2Cu3O7 Polycrystal

Automated Determination of Lattice Orientation From Electron Backscattered Kikuchi Diffraction Patterns

An ODF Study of the Deformation and Recrystallization Textures of Rolled and Channel-die Compressed High Purity Copper

Effects of Deposition Conditions on Texture in Copper Thin Films on Si (111)

Texture and Strength Evolution in Deformed Polypropylene

Microstructure and Texture Evolution During the Annealing of Cold-worked Zr-1 wt%Nb

Grain Boundary Migration and the Texture of Films

Resolution of Superimposed Diffraction Peaks in Texture Analysis of a YBa₂Cu₃O₇ Polycrystal