Research Article
Thermal Cycling Life Prediction of Sn-3.0Ag-0.5Cu Solder Joint Using Type-I Censored Data
Table 1
The parameters for the Engelmaier fatigue model.
| | Parameters | Explanation | BGA (SAC305) | FBGA (SAC305) |
| | is the maximum distance between the solder joints of component (mm) | 23.3345 | 7.7666 | | The nominal height of the solder joint (mm) | 0.42 | 0.25 | | Cyclic temperature (°C) | 165 | 165 | | Empirical correction factor ([0.5, 1.5]) | 1 | 1 | | Fatigue ductility coefficient | 0.325 | 0.325 | | Zero stress reference temperature (°C) | 25 | 25 | | A half cycle dwell time (mins) | 15 | 15 |
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