The Scientific World Journal / 2014 / Article / Tab 1

Research Article

Thermal Cycling Life Prediction of Sn-3.0Ag-0.5Cu Solder Joint Using Type-I Censored Data

Table 1

The parameters for the Engelmaier fatigue model.

ParametersExplanationBGA (SAC305)FBGA (SAC305)

is the maximum distance between the solder joints of component (mm)23.33457.7666
The nominal height of the solder joint (mm)0.420.25
Cyclic temperature (°C)165165
Empirical correction factor ([0.5, 1.5])11
Fatigue ductility coefficient0.3250.325
Zero stress reference temperature (°C)2525
A half cycle dwell time (mins)1515