The Scientific World Journal / 2014 / Article / Tab 3

Research Article

Thermal Cycling Life Prediction of Sn-3.0Ag-0.5Cu Solder Joint Using Type-I Censored Data

Table 3

The input data of Minitab.

BGAFBGA
Initial time (cycles)Inspection time (cycles)Failure frequencyCumulative
failure prob. (%)
Initial time (cycles)Inspection time (cycles)Failure frequencyCumulative
failure prob. (%)

025000030000
2505005030060053.68
500750710.43600800910.29
75010001296.588001000413.24
1000150016817.75100014001020.59
150020007432.29140018001733.09
2000250012341.3180022001443.38
2500*55651.9522002500849.26
2500*69