Thermal Cycling Life Prediction of Sn-3.0Ag-0.5Cu Solder Joint Using Type-I Censored Data

Table 3

The input data of Minitab.

BGA				FBGA
Initial time (cycles)	Inspection time (cycles)	Failure frequency	Cumulative; failure prob. (%)	Initial time (cycles)	Inspection time (cycles)	Failure frequency	Cumulative; failure prob. (%)
0	250	0	0	0	300	0	0
250	500	5	0	300	600	5	3.68
500	750	71	0.43	600	800	9	10.29
750	1000	129	6.58	800	1000	4	13.24
1000	1500	168	17.75	1000	1400	10	20.59
1500	2000	74	32.29	1400	1800	17	33.09
2000	2500	123	41.3	1800	2200	14	43.38
2500	*	556	51.95	2200	2500	8	49.26
				2500	*	69