An Analytic Expression of Thermal Diffusion Coefficient for the Hydrodynamic Simulation of Semiconductor Devices

Abstract

A new analytical expression of thermal diffusion coefficient DT is derived. To the firstorder approximation, it is given by (1+η)^-1(D/Tn) rather than (1–η)(D/Tn) where η=–(Tn/η^*)(∂η^*/∂Tn ) and η^* represents the temperature-dependent bulk mobility. This new transport coefficient is implemented in our 2-D hydrodynamic device simulator and it seems to produce more reasonable results.