(a)
(b)
(c)
(d)
Figure 13: (a) Simplified circuitry schematic of the differential cascode SiGe PA used in [33]; (b) simplified block diagram of our CMOS envelope modulator with its connection to the differential cascode SiGe PA on the same die; (c) chip micrograph of the world-first single-chip ET-PA (1.1 × 1.5 mm2); (d) measured overall PAE and EVM (at ) of the single-chip ET-PA for the LTE 16 QAM 5 MHz signal at 0.8/1.75/2.4 GHz.