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Emerging Microwave Technologies in the Internet of Things Era

Call for Papers

The Internet of Things is predicted to revolutionize the telecommunications paradigm by enabling direct integration between humans, the physical world, and machines. In this new era, devices, natural objects, infrastructures, and humans will be equipped with sensory and communication systems. The wide range of interconnected entities comprises buildings, transportation, wearables, food, cities, factories, implantables, and others.

In this context, novel microwave technologies will play an important role as the enabler of ubiquitous connectivity. These new microwave technologies must simultaneously optimize cost, size, power, and performance while minimizing environmental impact. Thus, such technologies should cater for novel designs to comply with the needs of low power, compact size, high performance, low cost, and low environmental impact.

The fast growth of the Internet of Things creates a plenty of scientific challenges in need of original engineering and research efforts from both academia and industry for the development of a wide range of microwave systems and components. This special issue brings together scholars, professors, researchers, and engineers to present state-of-the-art microwave systems, components, and technologies focused on transmitter/receiver design and sensors for the Internet of Things era.

Potential topics include but are not limited to the following:

  • Novel microwave sensors for the IoT (wearable sensors, structural sensors, biological sensors, implantable sensors, etc.)
  • Novel RFID technologies
  • Novel power efficient RF-ICs
  • Microwave energy harvesting technologies
  • Tunable and reconfigurable RF/microwave technologies
  • Novel microwave circuits using additive manufacturing
  • Novel microwave circuits using biodegradable materials
  • Antennas and microwave components for wearables and implantables
  • Novel passive circuits for microwave front-ends (antennas, filters, dividers, couplers, phase shifters, etc.)
  • Novel microwave metamaterial devices

Authors can submit their manuscripts through the Manuscript Tracking System at https://mts.hindawi.com/submit/journals/wcmc/emtit/.

Submission DeadlineFriday, 30 March 2018
Publication DateAugust 2018

Papers are published upon acceptance, regardless of the Special Issue publication date.

Lead Guest Editor

  • Alonso Corona-Chavez, National Institute of Astrophysics, Optics and Electronics, Tonantzintla, Mexico

Guest Editors