Active Microstructured Optical Arrays of Grazing Incidence Reflectors

Figure 7

Schematic of the piezo actuator bonded to silicon wafer. A quarter of a 1-D chip is shown. The bottom left corner contains the etched channels which cover $2\times 2\hspace{0.17em}{\text{mm}}^2$ in the centre of the chip. The dashed line indicates dimensions which were varied in the FEA modelling.