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Advances in Power Electronics
Table of Contents
Advances in Power Electronics
/
2008
/
Article
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Fig 13
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Research Article
On-Chip Bondwire Magnetics with Ferrite-Epoxy Glob Coating for Power Systems on Chip
Figure 13
Comparison of
Q
factors between the state-of-the-art MEMS micro-inductors, commercial wire wound inductors, and the bondwire inductors.