Journal Menu
- About this Journal
- Abstracting and Indexing
- Aims and Scope
- Article Processing Charges
- Articles in Press
- Author Guidelines
- Bibliographic Information
- Citations to this Journal
- Contact Information
- Editorial Board
- Editorial Workflow
- Free eTOC Alerts
- Publication Ethics
- Reviewers Acknowledgment
- Submit a Manuscript
- Subscription Information
- Table of Contents
ElectroComponent Science and Technology
Volume 4 (1977), Issue 2, Pages 85-88
doi:10.1155/APEC.4.85
Techniques for the Examination of Thick Film Resistor Microstructures by T.E.M.
Plessey Company Limited, Northants, Caswell, UK
Received 30 May 1977
Copyright © 1977 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
Abstract
This paper discusses the preparation techniques which can be used for the examination of thick film resistor microstructures by Transmission Electron Microscopy. The application of this technique, including High Voltage Electron Microscopy and Electron Microscope Mass Analysis, to both Ruthenium Dioxide and Bismuth Ruthenate based thick film resistors, is considered.