About this Journal Submit a Manuscript Table of Contents
ElectroComponent Science and Technology
Volume 6 (1980), Issue 3-4, Pages 185-187
http://dx.doi.org/10.1155/APEC.6.185

An Alternative Way of Making Bumps for Tape Automated Bonding

Research Institute for Mathematical Machines, Prague, Czech Republic

Received 11 June 1979

Copyright © 1980 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

How to Cite this Article

Karel Kopejtko and Jindřich Vilím, “An Alternative Way of Making Bumps for Tape Automated Bonding,” ElectroComponent Science and Technology, vol. 6, no. 3-4, pp. 185-187, 1980. doi:10.1155/APEC.6.185