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ElectroComponent Science and Technology
Volume 6 (1980), Issue 3-4, Pages 185-187
doi:10.1155/APEC.6.185
An Alternative Way of Making Bumps for Tape Automated Bonding
Research Institute for Mathematical Machines, Prague, Czech Republic
Received 11 June 1979
Copyright © 1980 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
How to Cite this Article
Karel Kopejtko and Jindřich Vilím, “An Alternative Way of Making Bumps for Tape Automated Bonding,” ElectroComponent Science and Technology, vol. 6, no. 3-4, pp. 185-187, 1980. doi:10.1155/APEC.6.185