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ElectroComponent Science and Technology
Volume 6 (1980), Issue 3-4, Pages 263-263
http://dx.doi.org/10.1155/APEC.6.263
Short Communication

Helium Leak Measurements as a Predictor of Hermetic Package Life in Surgically-implanted Microelectronic Devices

MRC Neurological Prostheses Unit, 1 Windsor Walk, London SE5 8BB, UK

Received 27 April 1979

Copyright © 1980 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Abstract

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