Journal Menu
- About this Journal
- Abstracting and Indexing
- Aims and Scope
- Article Processing Charges
- Articles in Press
- Author Guidelines
- Bibliographic Information
- Citations to this Journal
- Contact Information
- Editorial Board
- Editorial Workflow
- Free eTOC Alerts
- Publication Ethics
- Reviewers Acknowledgment
- Submit a Manuscript
- Subscription Information
- Table of Contents
ElectroComponent Science and Technology
Volume 6 (1980), Issue 3-4, Pages 263-263
doi:10.1155/APEC.6.263
Short Communication
Helium Leak Measurements as a Predictor of Hermetic Package Life in Surgically-implanted Microelectronic Devices
MRC Neurological Prostheses Unit, 1 Windsor Walk, London SE5 8BB, UK
Received 27 April 1979
Copyright © 1980 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
Abstract
This article has no abstract.