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ElectroComponent Science and Technology
Volume 7 (1980), Issue 1-3, Pages 171-179
http://dx.doi.org/10.1155/APEC.7.171

Influence of Evaporation-Deposition Geometry on Conductive Thin Films

Siemens AG, München, Germany

Received 19 May 1980

Copyright © 1980 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Abstract

There is a striking dependence of the evaporation deposition geometry (i.e. angular distribution of the incident vapor beam) on the properties of deposited conductive films. This paper discusses solderability, adhesion and long-term stability of adhesion of Ti-Pd-Au, Ti-Au and Ti-Cu films. In all cases the above properties were improved by an evaporation deposition geometry with steep angles of the incident vapor beam.